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This is the free Material Data Center Datasheet of Ultramid® Advanced N2U40G7 LS BK - PA9T-GF35 FR - BASF

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材料文字说明
该产品是一种无卤阻燃高温聚酰胺,具有高流动性、耐高温表面贴装技术(SMT)、优异的机械性能和高尺寸稳定性,这些都使其非常适合电子电气应用,尤其是各种薄壁连接器和插座。
加工/物理特性干 / 已调节单位Test Standard
ISO数据
熔体体积流动速度, MVR 25 / * cm³/10min ISO 1133
温度 325 / * °C -
载荷 2.16 / * kg -
模塑收缩率, 平行 0.2 / * % ISO 294-4, 2577
模塑收缩率, 垂直 0.8 / * % ISO 294-4, 2577
机械性能干 / 已调节单位Test Standard
ISO数据
拉伸模量 12500 / - MPa ISO 527
断裂应力 150 / - MPa ISO 527
断裂伸长率 2 / - % ISO 527
无缺口简支梁冲击强度, +23°C 60 / - kJ/m² ISO 179/1eU
简支梁缺口冲击强度, +23°C 13 / - kJ/m² ISO 179/1eA
热性能干 / 已调节单位Test Standard
ISO数据
熔融温度, 10°C/min 305 / * °C ISO 11357-1/-3
热变形温度, 1.80 MPa 275 / * °C ISO 75-1/-2
线性热膨胀系数, 平行 14 / * E-6/K ISO 11359-1/-2
线性热膨胀系数, 垂直 62 / * E-6/K ISO 11359-1/-2
电性能干 / 已调节单位Test Standard
ISO数据
相对漏电起痕指数 - / 600 - IEC 60112
其它性能干 / 已调节单位Test Standard
密度 1490 / - kg/m³ ISO 1183
模塑测量的特殊性能干 / 已调节单位Test Standard
ISO数据
粘数 70 / * cm³/g ISO 307, 1157, 1628
典型数据
加工方法
注塑
供货形式
粒料, 黑色
特殊性能
阻燃的, 无卤
应用
电子电气
地区供应
其他信息
注塑成型
PREPROCESSING
Pre/Post-processing, max. allowed water content: .1 %
Pre/Post-processing, Pre-drying, Temperature: 120 °C
Pre/Post-processing, Pre-drying, Time: 6 - 8 h

PROCESSING
injection molding, Melt temperature, range: 310 - 340 °C
injection molding, Melt temperature, recommended: 330 °C
injection molding, Mold temperature, range: 100 - 160 °C
injection molding, Mold temperature, recommended: 140 °C
injection molding, Dwell time, thermoplastics: 5 min
权利义务的法律声明
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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